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PLS63

Performance MTC Module (LTE Cat.1) Global

The PLS63-W offers a global approach to cost-optimized IoT connectivity, with 18 Band LTE Cat.1, Eight Band 3G HSPA/UMTS, and Quad-Band GSM for seamless coverage across multiple wireless networks. Alternatively, where a global solution is not required, a variety of regional variants with the latest network banding deliver targeted connectivity for North America, Europe and APAC, Latin America and Japan.

Global and Regional LTE coverage with fallback options:

LTE Cat 1, Global and multiple Regional variants with latest network bonds grouping
3G and 2G fallback

Close-up of a Telit Cinterion electronic component with the model PLS63-W and IMEI 123456789012345 printed on it, next to a green circuit board.

Overview

Tech Specs

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Product Brief

Product Description

Fully Featured modem implementation:
– Integrated IP connectivity
– VoLTE and CS voice
– Extended set of AT commands

Lower Total Cost of Ownership:
– Embedded GNSS
– Embedded SIM
– Embedded Processing

State of the art security:
– Secure boot
– Secure key store
– Key life cycle management

Easy Connectivity and Lifecycle Management:
– Secure enrollment toward main cloud platforms
– Remote update and device management

Form Factor Family

LGA pad soldering mount, MSL3

Overview

Product Features

3GPP Rel.10 Compliant Protocol Stack
FDD-LTE: bands 1, 2, 3, 4, 5, 7, 8, 12, 13,14 (PLS63-X only), 17 (PLS63-LA only), 18, 19, 20, 26, 28, 66, 71 (PLS63-X only)
TD-LTE: bands 38, 40, 41
UMTS (WCDMA/FDD): bands 1, 3, 2, 4, 5, 6, 8, 19
Quad Band GSM: 850, 900, 1800, 1900 MHz
Integrated GNSS support (GPS/BeiDou/GLONASS/Galileo)
SIM Application Toolkit, letter classes b, c, e with BIP and RunAT support
Control via standardized and extended AT commands (Hayes, TS 27.007 and 27.005)
Embedded IP stack with IPv4 and IPv6 support
TCP/IP stack access via AT command and transparent TCP/UDP services
Secure Connection with TLS/DTLS
Internet Services TCP/UDP server/client, DNS, Ping, HTTP, SMTP, FTP client
RoHS compliant

Specifications:

FDD-LTE Cat.1 DL: max. 10.2 Mbps, UL: max. 5.2 Mbps
HSPA+ Cat.8 data rates DL: max. 7.2 Mbps, UL: max. 5.76 Mbps
E/GPRS Class 12 DL: max. 237 kbps, UL: max. 237kbps
SMS text and PDU mode support
Multiple Operator VoLTE support, CSFB (circuit-switched fallback)High quality narrow and wideband voice support for handset, headset and hands-free operation (HR, FR, EFR and AMR-WB)

Certifications

RED, GCF, CE, FCC, PTCRB, IC, UL, CCC, IFETEL, UKCA, Anatel, JATE, TELEC
AT&T (Firstnet), Verizon, Telstra, NTT Docomo, KDDI, DTAG, Vodafone

Dimensions:

33 x 29 x 2.6 mm

Form factor:

LGA pad soldering mount, MSL3

Supply voltage range:

3.0 – 4.5 V

Operating temperature:

-40°C to +85°C

Interfaces:

Power Supply for Baseband, Radio Domain
Pads for RX-Diversity /MIMO Antennas
Pads for GNSS antenna
USB 2.0 interface up to 480 Mbps
High speed serial modem interface ASC0
16 GPIO lines shared with DSR, DTR, DCD (all ASC0), ASC1 (RXD, TXD, RTS, CTS), SPI, Fast-Shutdown, Network Status-Indication, PWM, Pulse-Counter lines, TX-Indicator, 700MHz-Indicator
ADC and I2C interface
Digital audio interface (PCM and I2S modes)
Dual UICC and U/SIM card interfaces 1.8V/3V
Lines for Module-On and Reset
DAI
SGMII