Modules, Connectivity

Embedded IoT Connectivity: Seizing the IoT Opportunity

June 17, 2022

The Internet of Things (IoT) field is maturing fast, driven by growing 5G technology adoption and an array of use cases. According to Counterpoint Research, by 2030, cellular IoT module shipments will exceed 1.2 billion units worldwide. This shipping increase reflects a 12% compound annual growth rate (CAGR).  

Technologies like 4G Cat 1, LTE-M, narrowband IoT (NB-IoT) and soon 5G are driving IoT ascendance. For organizations looking to build on this momentum, it’s a unique moment of transition — and opportunity. 

Scale Your IoT Deployment with NExT EMBEDDED™

Customers are clamoring for solutions to support uses cases, including:  

This demand is pressuring operators and IoT developers to get mobile devices to market faster and cost-effectively.  

Embedded IoT Connectivity Points the Way Forward

Competition is fierce. You must keep pace with SIM card and connectivity technology supported by networks you are deploying under now. Simultaneously, you must also keep an eye on developments to future-proof your deployment. The market must embrace bundled module and SIM solutions to mitigate this concerning source of rising complexity. 

These solutions offer a variety of advantages, such as:  

  • Reduced device engineering and operational complexity  
  • Smaller form factors  
  • Lower bill of material (BOM) cost and total cost of ownership (TCO) 

These bundles are backed by the embedded Universal Integrated Circuit Card (eUICC), a set of global standards by the GSMA. These standards also prescribe and define support for critical processes for IoT at scale. One vital process is remote SIM provisioning and network profile switching without physically touching the SIM card.

Balancing Security, Flexibility and Manageability

Like any advanced technology, module and SIM bundled solutions require considerations. You must ensure that the embedded IoT connectivity solution you choose allows you to: 

  • Avoid technology lock-in by maintaining the flexibility to work with other vendor solutions if needed 
  • Retain the option to support an external SIM for customers that require the more traditional approach  
  • Ensure robust security to protect against evolving threats with advanced, layered cybersecurity for the entire life cycle 
  • Reduce operational complexity to ease deployment, simplify management and keep costs in check, particularly at scale 

An Advanced Embedded Connectivity Model for Today and Tomorrow

Telit Cinterion’s embedded connectivity modules is conceived to enable device deployment with out-of-the-box connectivity to:  

  • Reduce costs  
  • Ease complexity  
  • Enable simple or massive deployment scaling  

These IoT enablement solutions include an option to work with or without a SIM socket. They support ultrathin, small-footprint SIM chips for chip-on-module functionality and the ability to add and manage new profiles. These features, which make embedded connectivity solutions attractive, are often pitched as a box checked by connectivity providers. 

It is crucial to verify if the scope and ease of use are adequate for your technical and business plans. It’s easy for a provider to claim having embedded SIM (eSIM)/eUICC, iSIM and multi-IMSI support. However, combining these technologies and capabilities into usable solutions is challenging. 

Telit Cinterion has long been a leader in the IoT connectivity market with offerings like NExT EMBEDDED™. This embedded connectivity solution in our cellular IoT module portfolio removes the need for a SIM tray or a SIM chip. It offers superior flexibility over any physical SIM solution.

The technology is unfortunately not yet adopted worldwide. Therefore, it must be augmented by eSIMs or traditional SIMs for deployments requiring global reach. 

Only a complete SIM solution portfolio can tackle scaling and future-proofing IoT deployment challenges. IoT enablers must offer an eSIM solution featuring SIM chips embedded within the module. eSIMs are ideal for applications in which the IoT sensor or device is in a hard- or expensive-to-access location. The eSIM solution removes the need for costly and inconvenient SIM card replacement.  

Embedded connectivity offerings must keep you competitive without locking you into a specific technology roadmap. Ensure the vendor you select can demonstrate easy mobile network operator (MNO) profile switching at scale as an over-the-air update utilizing the eUICC standard. 

Security is fundamental for IoT applications. It must be deeply integrated within connectivity solutions to be effective. Telit Cinterion is an active player in the cybersecurity community. We collaborate with our partners to stay ahead of security vulnerabilities and the risks of IoT environments. 

Easy to Purchase, Implement and Manage 

Bundled offerings must be created with a ground-up integrated approach that makes purchasing and deploying operationally easy. All cellular IoT devices require a module and a SIM. Bundle adoption means you don’t need to place multiple orders and await several shipments. You can focus on one invoice, shipment and package that arrive together. 

Deployment and management are simple as well. Visibility via one interface and zero-touch provisioning empowers you to roll out and manage systems at a massive scale. 

Interoperability between the module and the SIM is guaranteed because of extensive testing from the same vendor. The same vendor will be your one interface for troubleshooting issues in the field. Having one vendor avoids long back-and-forths between various vendors for modules and connectivity to identify the root cause. 

We offer versatile solutions to make the most of IoT opportunities and maintain your competitive edge. Building on more than 22 years of connectivity expertise, we can help you smoothly migrate to 5G and transitional 4G enhancements.  

Choose a trusted provider with the knowledge and portfolio to support you now and in the future. Speak with our IoT connectivity experts to realize your IoT investment’s full potential.