IoT Module Delivering Global High-Speed LTE Cat.4

The PLS83-W IoT Module provides global high-speed IoT connectivity with 2G/3G fallback, with 18 Band LTE Cat.4, Eight Band 3G UMTS/WCDMA, and Quad-Band GSM for seamless coverage when roaming across different wireless networks. When a global solution is not needed, a variety of regional variants with the latest network band groupings deliver targeted connectivity for North America, Europe, Asia-Pacific, Latin America and Japan.

Global and Regional LTE coverage with fallback options:

  • LTE Cat 4, Global and multiple Regional variants with latest network bands grouping
  • 3G and 2G fallback
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Product Description

Fully Featured modem implementation
– Inegrated IP connectifvity
– VoLTE and CS voice
– Extended set of AT commands

Lower Total Cost of Ownership
– Embedded GNSS
– Embedded SIM
– Embedded Processing

State of the art security
– Secure boot
– Secure key store
– Key lite cycle management

Connectivity and Lifecycle Management
– Secure enrollment toward main cloud platforms
– Remote update and device management

Form Factor Family

LGA pad soldering mount, MSL3


Product Features

  • 3GPP Rel.10 Compliant Protocol Stack
  • FDD-LTE: bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 18, 19, 20, 26, 28, 66
  • TD-LTE: bands 38, 40, 41
  • UMTS (WCDMA/FDD): bands 1, 2, 3, 4, 5, 6, 8, 19
  • Quad Band GSM: 850, 900, 1800, 1900 MHz
  • Integrated GNSS support (GPS/BeiDou/GLONASS/Galileo)
  • SIM Application Toolkit, letter classes b, c, e with BIP and RunAT support
  • Control via standardized and extended AT commands
  • (Hayes, TS 27.007 and 27.005)
  • Embedded IP stack with IPv4 and IPv6 support
  • TCP/IP stack access via AT command and transparent TCP/UDP services
  • Secure Connection with TLS/DTLS
  • Internet Services TCP/UDP server/client, DNS, Ping, HTTP,
  • SMTP, FTP client
  • LGA pad soldering mount, MSL3
  • RoHS compliant


  • FDD-LTE Cat.4 DL: max. 150 Mbps, UL: max. 50 Mbps
  • HSDPA Cat.10 / HSUPA Cat.6 data rates DL: max. 14.4 Mbps, UL: max. 5.76 Mbps
  • E/GPRS Class 12 DL: max. 237 kbps, UL: max. 237kbps
  • SMS text and PDU mode support
  • Multiple Operator VoLTE support, CSFB (circuit-switched fallback)
  • High quality narrow and wideband voice support for a handset, headset and hands-free operation (HR, FR, EFR and AMR-WB)


  • AT&T (Firstnet), Verizon, Telstra, NTT Docomo, KDDI


  • 33 x 29 x 2.6 mm

Form factor:

  • LGA pad soldering mount, MSL3

Supply voltage range:

  • 3.0 – 4.5 V

Operating temperature:

  • -40°C to +85°C


  • Power Supply for Baseband, Radio Domain
  • Pads for RX-Diversity /MIMO Antennas
  • Pads for GNSS antenna
  • USB 2.0 interface up to 480 Mbps
  • High-speed serial modem interface ASC0
  • 16 GPIO lines shared with DSR, DTR, DCD (all ASC0), ASC1 (RXD, TXD, RTS, CTS), SPI, Fast-Shutdown,
    Network-Status-Indication, PWM, Pulse-Counter lines, TX-Indicator, 700MHz- Indicator
  • ADC and I2C interface
  • Digital audio interface (PCM and I2S modes)
  • Dual UICC and U/SIM card interfaces 1.8V/3V
  • Lines for Module-On and Reset
  • DAI

Special Features:

  • USB Interface features a composite mode, compliant to Windows, Linux and Mac
  • Firmware update via USB and ASC
  • RLS Monitoring (Jamming detection)
  • Informal Network Scan
  • Cell ID based Location Support
  • Module Services
  • Embedded Processing (optional)
  • eSIM


  • USB, MUX driver for Microsoft® Windows 7™, Microsoft®, Windows 8™ and Microsoft® Windows 10™
  • RIL Driver for Android
  • Ofono for Linux
User Guides, Documentation, Application Notes, and Firmware

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