802.11 a/b/g/n

The WE310G4 is a fully integrated, dual-band, combination Wi-Fi and Bluetooth® Low Energy 5.0 module. It provides an easy, cost-effective way for manufacturers to add wireless connectivity to their products.

  • Serial-to-Wi-Fi hosted implementation
  • Telit IoT AppZone IDE for hostless customer application development
  • Ease of system integration, pin-to-pin compatible with WE310F5 (single-band module alternative)
  • Wide range of peripherals (including UART, SPI, USB and SDIO)
  • Advanced security features (including WPA3) with integrated crypto hardware
  • Industrial-grade temperature range (-40° C to +85° C)
  • Variants with (WE310G4-I) and without (WE310G4-P) antenna
  • Legacy support for AT commands from GainSpan module family
  • Certified module low power consumption
  • Based on Realtek Ameba system on chip
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Product Description

The WE310G4 module enables device vendors to add dual-band Wi-Fi and Bluetooth® Low Power 5.0 connectivity quickly and cost-effectively to their products. This module provides an high-speed serial to Wi-Fi/Bluetooth® Low Power connection to an embedded design, built on an 8/16/32-bit microcontroller, through its interfaces. Furthermore, the module can be implemented as a hostless (stand-alone) solution, offering up to 456Kb of SRAM dedicated for customer application development. Based on the Realtek Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded devices, including smart lighting, home appliances, medical wearables, smart city sensors, aftermarket telematics and industrial robots.

Form Factor Family

The 94-pad LGA footprint supports connections for a comprehensive set of interfaces and controls, with a surplus of reserve pads to futureproof the end device for coming cellular and short range wireless standards, specialized antennas, faster data interfaces, and others. The flexible perimeter concept allows modules in the family to go in sizes from around 300 mm2 to below 200 mm2 while maintaining full pin-to-pin compatibility across different size groups.


Product Features

  • Wi-Fi 802.11 a/b/g/n 2.4 GHz and 5 GHz
  • Bluetooth® Low Power 5.0
  • Wi-Fi AP/STA/concurrent
  • Bluetooth® central/peripheral/concurrent
  • Built-in Wi-Fi/Bluetooth® coexistence
  • Host interfaces: UART, SPI, SDIO, USB


  • Wi-Fi Alliance
  • Bluetooth® SIG

Hardware Specifications

  • LGA 94 pads
  • Length x width x height: 14.3 x 13.3 x 2.6 mm (ext. ant.)
  • Length x width x height: 18 x 15 x 2.6 mm (int. ant.)
  • Temperature range: -40° C to +85° C

Electrical Specifications

  • Power supply: 3.3 V

Software Features

  • Cloud agent: Amazon AWS IoT, Microsoft Azure
  • Security: SecureBoot, WPA3, TrustZone
  • Telit Stile AT commands
  • Support for legacy GainSpan AT commands
  • Example applications for STM host controllers
User Guides, Documentation, Application Notes and Firmware

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