More goes into creating a successful Internet of Things (IoT) device than just getting online. Each stage of the IoT journey faces connectivity challenges. A flawed design and rollout can negatively impact performance and costs. Poor long-term life cycle management limits scalability.
Connectivity failures in mission-critical use cases cause real-world downtime and lost revenue for:
- Retail point-of-sale systems
- Wearable medical devices
Companies used to rely on dual-SIM configurations and manual failover solutions, which increased complexity and cost.
eSIM and Multiprofile: A Smarter Path to Resilient IoT Connectivity
Advanced eSIM technology and multiprofile capabilities offer a better path forward. These tools enable seamless remote provisioning and automatically switch devices between networks. Physical access or manual intervention is no longer required.
With Telit Cinterion’s expertise and the power of NExT™ eSIM multiprofile, organizations can:
- Deploy devices globally without being tied to a single carrier
- Automatically maintain service during network outages or coverage gaps
- Reduce operational costs and avoid costly SIM swaps in the field
No matter the industry, this conversation will help future-proof your connectivity strategy.
Key Takeaways
Watch this Q&A-style discussion with IoT connectivity expert Noam Shany as we explore:
- Common connectivity pitfalls across the IoT life cycle
- How to build resilience and redundancy into your deployments
- The advantages of eSIM and multiprofile support for mission-critical IoT
- What to look for in a global IoT connectivity partner