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Home > About Telit > Press Releases

Press Releases

October 2, 2024

Telit Cinterion Showcases NExT IoT Connectivity Starter Kit for Nine Major Verticals

August 7, 2024

Telit Cinterion Enables Next-Generation Cellular LPWA Deployments on AT&T with the ME310M1 IoT Module

July 24, 2024

Telit Cinterion NE310L2 Series of NB-IoT Modules for Power- and Cost-Sensitive IoT Applications Certified by Korea’s LG U+

April 8, 2024

Telit Cinterion and Taoglas Launch Antenna Tuning Reference Design for Rapid Development of Small Form Factor IoT Devices at Embedded World 2024

April 4, 2024

Telit Cinterion Unveils High-Precision Global Navigation Satellite System IoT Module with Centimeter-Level Accuracy at Embedded World 2024

February 22, 2024

Telit Cinterion Introduces the Latest 5G eMBB LGA Modules at MWC Barcelona 2024, Powered by the Snapdragon X72 5G Modem-RF System

February 21, 2024

Telit Cinterion Teams with Digi International and Nokia to Transform IoT Connectivity with 5G RedCap Integration; Showcases Live Demo at MWC Barcelona 2024

January 9, 2024

Telit Cinterion and Alif Semiconductor Unveil the Vision AppKit: A Postage Stamp-Sized, Intelligent Connected Camera Platform

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