February 25, 2016

World’s smallest Internet of Things LTE Cat.1 module from Telit approved for use on Verizon’s 4G wireless network

London, February 25, 2016 – Telit, a global enabler of the Internet of Things (IoT), today announced the availability of the LE866-SV1, an LTE Category 1 module that is certified on Verizon’s 4G LTE network, the largest and most reliable LTE network in the US. With its ultra-compact 15 x 25 mm LGA footprint, the new module is ideal for IoT applications with severe space constraints such as wearable trackers, health monitoring devices and smart watches.

The LTE Cat.1 cellular standard is well suited to meet technical and business requirements in the IoT. With the LE866-SV1 Telit is on the forefront of innovation providing not only significantly increased battery life for wearable electronics but also reducing design cost and complexity for other thriving segments like fleet management, asset tracking, security and surveillance, point of sale and smart metering.

Oozi Cats, Group Chief Executive, commented:
“The launch of this module, which is certified on Verizon’s 4G LTE network, is an important step for us in our roll out of products and capabilities for the growing Internet of Things market.”

“The module will enable us to supply our customers with an ultra compact, high speed low power module for growing markets like wearables.  It is particularly suitable for both the health and sport sectors.”

“About the size of a thumbnail, the world’s smallest LTE Cat.1 module at launch is an achievement and reaffirms our commitment to innovation leadership in the IoT.”

The Telit IoT Portal-ready LE866-SV1 is member of the xE866-nested family, featuring pin-to-pin compatibility with 2G and 3G modules, the GE866 and the UE866 respectively. It enables fast time-to-market not only in regions like North America where LTE has already become the predominant cellular technology, but also in other geographies where GPRS and UMTS are still widely deployed. The family concept enables developers to employ a single PCB layout for 2G, 3G and 4G technologies, i.e. “design once and deploy globally.”

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