March 27, 2018

Telit Releases New Wi-Fi Bluetooth LTE Companion Module to Streamline Integration for IoT Applications

Telit Releases New Wi-Fi Bluetooth LTE Companion Module to Streamline Integration for IoT Applications

Companion to the popular LTE LE910Cx family, shortens engineering for applications

Module simplifies RF design, reducing burden of testing and certification

London, March 27, 2018 – Telit, a global enabler of the Internet of Things (IoT), today announced during Smart Cities Connect the release of a new module, the WE866C3.  The new module advances the ability to deliver LTE and Wi-Fi integration for IoT applications including security panels, video bridges, medical devices, telematics and remote sensors.

Telit’s WE866C3 is a low power, high bandwidth 802.11ac and Bluetooth 4.2 module with a small footprint that provides an easy and cost-effective way for manufacturers to add wireless connectivity to new and existing products. Advanced LTE, Wi-Fi and Bluetooth coexistence dramatically reduces complexity designing cellular back haul with the LE910Cx 4G LTE module family, making the WE866C3 ideal for a wide range of IoT applications including commercial building automation, OEM telematics, fleet management and video surveillance.  For more information, visit:

The module shortens time to market with off-the-shelf cloud connectivity through deviceWISE, over-the-air firmware updating, support for WPA/WPA2 personal and enterprise security and more. Developer tools, engineering support and comprehensive global certifications make it easy for integrators and OEMs to upgrade or launch new products.

“Telit modules are designed to address the needs of today’s growing IoT marketplace,” said Yossi Moscovitz, Telit President of Products and Solutions. “We’re pleased to see how products, services and applications that Telit enables are digitally transforming the way people interact, work and live with devices of all kinds.”

For more information please visit Telit during this week’s Smart Cities Connect conference located at booth 327.

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