November 12, 2026
New series brings local AI acceleration and real-time processing to industrial and connected-device designs
- Combines quad-core application processing with dedicated AI acceleration and a RISC-V microcontroller in a 41 x 43 mm module
- Supports cellular and noncellular designs through two module variants
- Helps simplify system design by bringing application processing, AI and real-time control into the established SE250B4 footprint
- Powered by the Qualcomm Dragonwing™ Q-2390 processor
Boca Raton, Nov. 12, 2026 — Telit Cinterion, an end-to-end IoT solutions enabler, today announced the SE250C4 series, a new generation of smart modules based on the Qualcomm Dragonwing™ Q-2390 processor from Qualcomm Technologies, Inc. Built in the 41 x 43 mm format used by the SE250B4 series, the new module pairs application-class processing with dedicated resources for AI and real-time workloads.
The SE250C4 has a quad-core architecture with one Arm Cortex-A78 and three Cortex-A55 cores. A Qualcomm® Adreno™ 704 GPU processes graphics, including 3D, while Qualcomm® Hexagon™ AI processing provides 1.1 trillion operations per second (TOPS) for on-device workloads. The architecture also includes a RISC-V microcontroller for functions that require real-time processing.
For more information about the SE250C4, visit Telit Cinterion’s SE250C4 Series product page.
Camera interfaces and full HD display support accommodate applications that process images or present graphical content. Running supported AI and vision functions on the device can reduce the need to send data to the cloud for processing.
Applications include:
- Industrial automation and control
- Robotics and autonomous equipment
- Retail and payment terminals
- Security and surveillance systems
- Smart displays and handheld devices
- Vision-enabled edge devices
- Smart home systems
The module design includes dual Ethernet with Time-Sensitive Networking, PCIe Gen2 and two USB interfaces. These interfaces connect the processor to wired networks and peripheral devices within the customer’s system design.
Compared with the SE250B4 generation, the SE250C4 introduces newer CPU and GPU resources in the same module dimensions. It adds:
- Dedicated AI processing
- A real-time microcontroller
- Full HD display support
LTE Cat 4 connectivity is available through the SE250C4-EU for Europe, China and other regions. Integrated GNSS provides simultaneous support for GPS, GLONASS, BeiDou and Galileo. The SE250C4-WE is a Wi-Fi-only, noncellular variant for worldwide use.
“Edge devices increasingly need to support application processing, local AI and deterministic control within a single architecture. By combining these capabilities with wireless connectivity in a compact module, the SE250C4 helps customers reduce system complexity, shorten development cycles and bring advanced edge applications to market faster,” said Marco Contento, VP Product Management Mobile Broadband and Smart Modules, at Telit Cinterion.
“Dragonwing Q-2390 brings together computing, 3D graphics, vision, AI and real-time control to help support the next generation of intelligent connected devices,” said Eric Mazzoleni, Vice President, Sales at Qualcomm Germany GmbH. “We’re pleased to work with Telit Cinterion on the SE250C4 and extend these capabilities across applications such as intelligent retail devices, payment terminals, smart home hubs and home robots.”