4-layer PCB is limited to 70x40mm. Heat sources are GL865 (2W max during class 10 GPRS upload) and switching regulator (0,475W). GPRS communication can take 1~30 minutes. PCB is inside polycarbonate/ABS case without air flow. See attached figure.
Do you think that it is possible to embed GL865 into device in such a way?
We haven’t a thermal model of the module that could be used for
customer’s case thermal calculation; however there is the AT#TEMPMON
command that can be used for measuring the internal temperature of the
module and so verify the max temperature reached during functioning.
This command it is described in Telit_AT_Commands_Reference_Guide_r10.pdf doc.
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