[F A Q] BGA modules

One thought on “[F A Q] BGA modules

  1. Q:

    What are the benefits of implementing a BGA module

     

    A:

    The unique ball
    grid array (BGA) package enables a low profile and small resulting
    product size for the design of compact applications. Since connectors
    are eliminated, the solution cost is significantly reduced compared to
    conventional mounting. With the low profile design, the BGA modules are
    the perfect platform for compact, medium to high M2M applications.