5 thoughts on “GL865 – thermal parameters of package”
GL865 Hardware User Guide mentions that heat generated during class 10 GPRS will be mostly conducted to the ground plane under the GL865 thus heat is mostly transferred through bottom surface of GL865.
Manufacturers of IC specifies thermal resistance between junction (source of heat) and case to help us design heatsink. What is thermal resistance between source of heat and bottom surface of GL865?
I can not see any thermal pads in the recommended footprint. Is heat transferred through pads or also through rest of the bottom surface?
Thanks.
We haven’t a thermal model of the module that could be used for
customer’s case thermal calculation; however there is the AT#TEMPMON
command that can be used for measuring the internal temperature of the
module and so verify the max temperature reached during functioning.
This command it is described in
Telit_AT_Commands_Reference_Guide_r10.pdf doc.
The heat is mostly transferred through the five GND pins (32, 33, 35,
36, 46); the GL865 hasn’t thermal pads. We don’t furnish the thermal
resistance between source of heat and bottom surface of GL865; however
the suggested footprint it is like that one in the attached picture.
Thanks for info.
I am aware of AT#TEMPMON and I plan to use it, but now I am in the design stage.
I have to decide whether I am able to dissipate heat from module.
It is strange for me that Telit hasn’t thermal model of module.
Can you give me recommendation for the minimal PCB dimmensions and layer stack required for cooling down module?
We don’t have notice that our competitors provide the thermal model of their modules. Moreover
isn’t so simple give recommendation for the minimal PCB dimensions and
layer stack required for cooling down module; the thermal transmission
can be done by radiation, convection and contact and so it depend from
the box (size, structure and kind of material).
GL865 Hardware User Guide mentions that heat generated during class 10 GPRS will be mostly conducted to the ground plane under the GL865 thus heat is mostly transferred through bottom surface of GL865.
Manufacturers of IC specifies thermal resistance between junction (source of heat) and case to help us design heatsink. What is thermal resistance between source of heat and bottom surface of GL865?
I can not see any thermal pads in the recommended footprint. Is heat transferred through pads or also through rest of the bottom surface?
Thanks.
We haven’t a thermal model of the module that could be used for
customer’s case thermal calculation; however there is the AT#TEMPMON
command that can be used for measuring the internal temperature of the
module and so verify the max temperature reached during functioning.
This command it is described in
Telit_AT_Commands_Reference_Guide_r10.pdf doc.
The heat is mostly transferred through the five GND pins (32, 33, 35,
36, 46); the GL865 hasn’t thermal pads. We don’t furnish the thermal
resistance between source of heat and bottom surface of GL865; however
the suggested footprint it is like that one in the attached picture.
Thanks for info.
I am aware of AT#TEMPMON and I plan to use it, but now I am in the design stage.
I have to decide whether I am able to dissipate heat from module.
It is strange for me that Telit hasn’t thermal model of module.
Can you give me recommendation for the minimal PCB dimmensions and layer stack required for cooling down module?
We don’t have notice that our competitors provide the thermal model of their modules.
Moreover
isn’t so simple give recommendation for the minimal PCB dimensions and
layer stack required for cooling down module; the thermal transmission
can be done by radiation, convection and contact and so it depend from
the box (size, structure and kind of material).