Global Technical Support Through Telit’s Worldwide Technical Support Centers

TTSC Europe
based in Trieste Italy with dedicated teams to assist customers in different phases of module acquisition and implementation.

TTSC APAC
based in Korea, Taiwan and China with experts in GSM, CDMA and UMTS technologies.

TTSC Americas
based in North Carolina with extensive experience in module implementation and certification, approvals process and requirements for the US market.

 

Technical Support Centers are the gateway into Telit’s R&D laboratories for direct contact with R&D experts.

 

Telit offers several valuable services to its customers:

 

Design Review:

The design review service can benefit all customers. During a design review, technical support experts and R&D work together to make a complete design review of the application thus assisting customers in facilitating the implementation phase. This service ensures optimal stability and performance for the customer's application and reduces overall time-to-market.

The service includes:

  • Schematics review
  • PCB layout review
  • Component placement advice
  • Component selection advice (to reduce the BOM)
  • Measurement and characterization of integrated antenna


Antenna analysis

 

 

Product Certification:

Telit offers global support to manage product certifications all over the world. Based on its global experience, Telit can assist customers with CE, FCC, CI, PTCRB, GCF and AT&T certifications. Additionally, its Korean R&D team can provide assistance with approvals related to CDMA and UMTS based products.

 

Pre-certification Test:

In its Trieste facility, Telit can perform pre-certification tests at the application level. This service assists customers with the certification process and provides a complete overview of the application's radio performance and speeds up the entire certification process.

 

In its eight meter anechoic chamber, Telit can offer the following test cases:

  • Radiated emission
  • Conducted emission (DC power input/output port)
  • Conducted emission (AC power input/output port)
  • Conducted emission (telecommunication port)
  • RF electromagnetic field (80MHz - 2000MHz)
  • Electrostatic discharge (enclosure)
  • Fast transients common mode (signal, telecommunications and control ports, AC and DC input ports)
  • RF common mode 0.15 MHz - 80 MHz (signal, telecommunications and control ports, AC and DC input ports
  • Transients and surges (DC power input ports)
  • Voltage dips and interrupts (AC power input ports)
  • Surges, line-to-line and line-to-ground (AC power input ports, telecommunication ports)

 

Spurious Emissions:

  • Radiated spurious emissions ALLOCATE CHANNEL (TS51010)
  • Radiated spurious emissions IDLE MODE

 

Power/Sensitivity:

  • Radiated power
  • Radiated sensitivity
Anechoic chamber
 Radiated power results
 Spurious emissions results
 Antenna directivity

 

Other Test Capabilities:


Audio Test Laboratory:

In its audio test laboratory, Telit offers custom audio parameters, which optimizes audio performance at the application level. The silent room makes its possible to reproduce different environmental noises in order to set different audio parameters, noise reduction and echo cancellation thus achieving the best possible results in different environmental scenarios.

It is also possible to remotely control and set the audio parameters using the ECHO SUITE, a specific software tool developed by Telit R&D audio experts. Using this tool, Telit's audio experts can control the audio performances of the application and can automatically configure the best parameters for echo cancellation and noise reduction. The system is automatic, environment independent, quick & easy, and portable.

 
Echo suite blocking diagram     Audio analysis
 Audio analysis Audio test block diagram

 

 

Validation Test on Manufacturing Process:

Telit also offers a Physical Validation Laboratory to assist customers with the pre-manufacturing process. Telit can perform several tests to check the solder joint reliability between BGA modules and the application PCB. Additionally, a complete analysis of the reflow process results can be conducted in Telit's laboratories.

An x-ray can be also taken at the application level to check the reflow process results.

 

x-ray of BGA
 Details Solder joint analysis

 

 

Telit can perform the following tests:

  • X-Ray analysis
  • Microscope analysis
  • Surface finishing analysis
  • Soldering paste analysis
  • Guest board planarity analysis


Surface finishing analysis
 Flourescence x-ray
 x-ray machine
 Optical