The WE865-DUAL is a Wi-Fi CERTIFIED™ IEEE 802.11 b /g short range wireless companion product to the PRO³ device family.

WE865-DUAL is a versatile and powerful addition to any PRO³-based design instantly adding the power of wireless communications and the versatility of the SDIO interface. At only 22mm square and no more than 3.5mm high, the diminutive dimensions also provide for a highly compact integrated customer solution.

The unique Ball-Grid-Array (BGA) package based on solder balls placed on the underside of a module which allows for direct mounting to the application circuit board, without the need for plugs, cables, or connectors.

The WE865-DUAL can be assembled using an automated pick-and-place assembly as with standard SMD components. This not only reduces material costs, but also installation time and assembly costs. The board-to-board BGA mounting is extremely stable and reliable. Together, the compact shape and reduced assembly costs are crucial advantages for use in cost-sensitive applications, such as those for the consumer market.

As a part of Telit’s corporate policy of environmental protection, all products comply to the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU Directive 2002/95/EG).

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