The HS 3002 is form factor compatible across all our modules, allowing manufacturers tremendous flexibility and versatility in developing and deploying worldwide solutions.
The modular architecture is shared across all platforms and powered by a programmable rules engine. The network router, control, and automation capabilities provide manufacturers with a flexible structural design for rapid product development and deployment.
Leading-edge silicon solutions from Qualcomm®
100-pin connector form factor is compatible across technologies
SIM carrier provides smallest overall system size
TCP/IP and UDP/IP software stack with Packet Assembler Disassembler